According to www.thelec.net, Samsung Electro-Mechanics reported first-quarter 2026 revenue of 3.2091 trillion won and operating profit of 280.6 billion won, marking the company’s first time exceeding 3 trillion won in quarterly revenue. The results represent a 17% year-on-year increase in revenue and a 40% year-on-year jump in operating profit compared to the same period in 2025, when revenue stood at 2.7386 trillion won and operating profit at 200.5 billion won.
Segment Performance: MLCCs, FC-BGA Substrates, and Camera Modules Drive Growth
The components division generated 1.4085 trillion won in revenue, up 16% year on year. This growth was fueled by rising demand for multilayer ceramic capacitors (MLCCs) used in AI servers, power infrastructure, and networking equipment — alongside expanded shipments of automotive MLCCs supporting vehicle electrification. The package solutions division posted 725 billion won in revenue, surging 45% year on year, driven by increased supply of flip chip ball grid array (FC-BGA) substrates for AI accelerators, server CPUs, and networking gear serving global big tech customers. Automotive FC-BGA substrates for advanced driver-assistance systems (ADAS) and autonomous driving also contributed.
The optical solutions division recorded 1.0756 trillion won in revenue, a 5% year-on-year increase. This reflected mass production of high-performance camera modules — including 200-megapixel sensors and slim folded zoom modules — as well as expanded in-cabin camera supply for domestic automakers and increased volume for electric vehicles.
Product-Specific Demand and Strategic Roadmap
- Samsung Electro-Mechanics cited expanded shipments of high-value industrial and automotive components, including MLCCs for AI servers and ADAS, and FC-BGA substrates for AI accelerators and server CPUs, as key earnings drivers.
- The company forecasts continued strong demand for high-value MLCCs and FC-BGA products amid data center upgrades and rising power consumption in AI servers.
- In the components division, it expects sustained demand for high-end products used in AI servers and data centers, and for automotive applications tied to wider ADAS adoption.
- The package solutions division plans to supply next-generation high-layer-count, large-area, and embedded substrates for AI accelerators and server CPUs, while ramping up new products for AI data center networks targeting global big tech clients.
- The optical solutions division aims to mass-produce next-generation high-resolution folded zoom camera modules for flagship smartphones and ramp up next-generation models aligned with new global EV platforms.
Industry Context and Supply Chain Implications
Samsung Electro-Mechanics’ performance reflects broader semiconductor supply chain dynamics. As SK hynix reported a 72% operating margin in its own Q1 2026 results — also published by www.thelec.net — and as LPKF targets mass production of glass substrates beginning in 2027, substrate and passive component suppliers are gaining strategic leverage. The surge in FC-BGA demand parallels Nvidia’s Vera Rubin platform rollout, for which SK hynix began mass production of 192GB SOCAMM2 modules — another development covered in the same media outlet’s top-10 most-read list. For supply chain professionals, this signals tightening capacity for high-layer-count organic substrates and increasing technical requirements for automotive-grade MLCCs rated for >150°C operation and AEC-Q200 compliance. Lead times for FC-BGA substrates serving AI accelerator ASICs now average 20–24 weeks across Tier-1 OSATs, per recent industry benchmarks from TechInsights’ May 2026 Component Supply Report.
Source: www.thelec.net
Compiled from international media by the SCI.AI editorial team.
