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Taiwan, EU Strengthen Chip Ties Amid Supply Chain Resilience Push

Taiwan and Europe are intensifying semiconductor cooperation to bolster supply chain resilience amid geopolitical strain and pandemic-related vulnerabilities. At the third Taiwan-Europe Chip Innovation Forum in Antwerp on September 9–10, Wu Cheng-wen of Taiwan’s National Science and Technology Council underscored shared democratic goals for secure supply networks. The second EU-Taiwan Semiconductor Industry Dialogue convened in Taipei on August 31, 2026, aligning Taiwan’s foundry and packaging strengths with Europe’s equipment and IP ambitions. A May 2026 Istituto Affari Internazionali report proposed early-warning systems and EDA software autonomy. Talent programs span the Czech Republic, Poland, and Germany, while TSMC’s Dresden investment anchors broader European supply-chain development.

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Taiwan, EU Strengthen Chip Ties Amid Supply Chain Resilience Push

According to globalsources.com, Taiwan and Europe are deepening semiconductor collaboration to build secure, resilient supply networks amid geopolitical tensions and pandemic-induced disruptions.

Strategic Shift Toward Resilience

The third Taiwan-Europe Chip Innovation Forum took place in Antwerp on September 9 and September 10, where Wu Cheng-wen, head of the National Science and Technology Council, stressed that democratic countries share a common goal: constructing supply networks that are both secure and resilient. He noted that political tensions and the COVID-19 pandemic have demonstrated how rapidly supply chains can fracture — especially in semiconductors, where design, equipment manufacturing, materials processing, packaging, and testing are dispersed across multiple countries.

Wu pointed out that Taiwan’s decades-long investment in semiconductor education, research, and manufacturing has yielded comprehensive capabilities — spanning advanced process technology, mature-node production, chip design, and advanced packaging. In contrast, he observed Europe’s declining advantage in semiconductor manufacturing and the United States’ reduced investment over the past 20 or 30 years.

This divergence underscores why cross-border cooperation is essential: chips underpin AI computing equipment, quantum computing systems, and future intelligent robotics — making semiconductor policy central to national security, economic stability, and technological development.

Complementary Capabilities and Policy Alignment

The European Commission confirmed that the second EU-Taiwan Semiconductor Industry Dialogue occurred in Taipei on August 31, 2026, coinciding with SEMICON Taiwan. The gathering brought together semiconductor companies, research institutes, and policymakers to discuss AI chips, data center infrastructure, and the European Chips Act 2.0 proposal.

The Commission highlighted how Taiwan’s core strengths in foundry services, packaging, and system integration align with Europe’s ambitions in chip architecture, design tools, and intellectual property development. This synergy reflects a deliberate pairing: Europe leads in upstream equipment, while Taiwan excels in advanced manufacturing — a dynamic identified in a May 2026 assessment by the Istituto Affari Internazionali (IAI).

That IAI report also proposed concrete resilience measures, including early-warning systems, stockpiling protocols, and a joint roadmap toward strategic autonomy in electronic design automation software — initiatives requiring coordinated action among governments, businesses, and research institutions.

Talent, Investment, and Emerging Sectors

Talent development is a pillar of the partnership: countries including the Czech Republic, Poland, and Germany have launched academic and research-based talent-exchange programs with Taiwan. The National Science and Technology Council and Ministry of Education in Taiwan also administer cooperative programs to strengthen personnel ties.

Wu emphasized that Taiwan’s semiconductor leadership does not negate the need for continuous innovation — citing opportunities for joint work in quantum technology, space technology, robotics, and advanced energy. He cited TSMC’s investment in Dresden as a catalyst: once demand emerges, Taiwanese and European firms could co-locate around the facility to form an integrated supply chain serving automotive chips, robotics, space systems, quantum applications, and biomedicine.

He added that future service robots and low-Earth-orbit communications satellites will depend heavily on AI and advanced chips — elevating Taiwan’s role in global innovation systems. According to the source, this industrial base extends directly into artificial intelligence, quantum computing, robotics, and space technology.

Source: globalsources.com

Compiled from international media by the SCI.AI editorial team.

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